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NUD4700SNT1G - onsemi

Description: A Simple Two Terminal Device; Automatically Resets Itself if the LED Heals Itself or is Replaced; ON-State Voltage Typically 1 V; OFF-State Current less than 250 µA; This is a Pb-Free Device

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NUD4700SNT1G - onsemi PCB footprint - Other - Other - POWERMITE-CASE-457-04-ISSUE-E
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NUD4700SNT1G - onsemi  - 3D model - Other - POWERMITE-CASE-457-04-ISSUE-E
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NUD4700SNT1G Details

  • Manufacturer Part Number:

    NUD4700SNT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    POWERMITE

  • Package Description:

    POERMITE-1

  • Pin Count:

    2

  • Manufacturer Package Code:

    457-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    COMPLEX

  • Critical Rate of Rise of Off-State Voltage-Min:

    250 V/us

  • DC Off-state Voltage-Max:

    10 V

  • Holding Current-Max:

    12 mA

  • JESD-30 Code:

    R-PSSO-G1

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.25 mA

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    1

  • On-state Current-Max:

    1300 A

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Repetitive Peak Off-state Voltage:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SILICON SURGE PROTECTOR

NUD4700SNT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2kV HBM and 200V MM protection is recommended.
  • Yes, the NUD4700SNT1G is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure high reliability. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specifications.
  • Start by verifying the device is properly powered and configured. Check for any signs of overheating, electrical overstress, or physical damage. Use oscilloscopes and logic analyzers to debug the circuit. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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NUD4700SNT1G Overview

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