A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid exceeding the maximum junction temperature (Tj) of 150°C.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
Use a shielded inductor, keep the layout compact, and minimize loop areas. Ensure that the device is placed away from noise sources and that the input and output traces are separated. Use a common-mode choke or ferrite bead to filter out high-frequency noise.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.
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