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NUP1105LT1G - onsemi

Description: Low Reverse Leakage Current (< 100 nA); IEC Compatibility: -IEC 61000-4-2 (ESD): Level 4 -IEC 61000-4-4 (EFT): 40 A - 5/50 ns -IEC 61000-4-5 (Lighting): 8.0 A (8/20 s); SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; SOT-23 Package Allows One Separate Bidirectional Configuration; 350 W Peak Power Dissipation per Line (8 x 20 usec Waveform); ISO 7637−3, Repetitive Electrical Fast Transient (EFT) TBD EMI Surge Pulses;

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PCB Footprints
NUP1105LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
NUP1105LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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NUP1105LT1G Details

  • Manufacturer Part Number:

    NUP1105LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Breakdown Voltage-Max:

    28.4 V

  • Breakdown Voltage-Min:

    25.7 V

  • Breakdown Voltage-Nom:

    27.05 V

  • Clamping Voltage-Max:

    44 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    350 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5; ISO 7637-1, -3

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP1105LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the NUP1105LT1G near a thermal pad or a heat sink, and ensuring good copper pour and thermal vias to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Yes, the NUP1105LT1G is suitable for high-reliability and automotive applications, as it meets the required standards for quality and reliability. However, it is essential to consult with onsemi's application engineers to ensure that the device meets the specific requirements of your application.
  • To handle ESD protection for the NUP1105LT1G, ensure that the device is handled and stored in an ESD-protected environment, and that ESD protection devices such as TVS diodes or ESD suppressors are used in the circuit design.

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