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NUP1128WTT1G - onsemi

Description: Low Reverse Leakage Current (< 100 nA); IEC Compatibility: IEC 61000−4−2 (ESD): Level 4 IEC 61000−4−4 (EFT): 50 A (5/50 ns) IEC 61000−4−5 (Lighting) 3.5 A (8/20 µs); ISO 7637−1, Nonrepetitive EMI Surge Pulse 2, 8.0 A (1/50 µs); ISO 7637−3, Repetitive Electrical Fast Transient (EFT) EMI Surge Pulses, 50 A (5/50 ns); +175°C TJ(MAX) rating; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These are Pb−Free Devices; Flamm

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PCB Footprints
NUP1128WTT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−70 (SOT−323)
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3D Models
NUP1128WTT1G - onsemi  - 3D model - SOT23 (3-Pin) - SC−70 (SOT−323)
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NUP1128WTT1G Details

  • Manufacturer Part Number:

    NUP1128WTT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70-3 / SOT-323-3

  • Package Description:

    SC-70, SOT-323, 3 PIN

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    35.5 V

  • Breakdown Voltage-Min:

    27.5 V

  • Breakdown Voltage-Nom:

    31 V

  • Clamping Voltage-Max:

    55 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    165 W

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    165 W

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5; ISO 7637-1, -3

  • Rep Pk Reverse Voltage-Max:

    26.5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    26.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP1128WTT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the junction temperature within the recommended range.
  • The NUP1128WTT1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NUP1128WTT1G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application.
  • The recommended soldering conditions for the NUP1128WTT1G involve using a soldering temperature of 260°C (max) for 10 seconds (max) when using a reflow soldering process. For wave soldering, use a temperature of 255°C (max) for 10 seconds (max).

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NUP1128WTT1G Overview

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