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NUP1301ML3T1G - onsemi

Description: Low Capacitance; Single Package Integration Design; Provides ESD Protection for JEDEC Standards JESD22; Protection for IEC61000-4-2 (Level 4); Ensures Data Line Speed and Integrity; Fewer Components and Less Board Space; Direct the Transient to Either Positive Side or to the Ground; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
NUP1301ML3T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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NUP1301ML3T1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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NUP1301ML3T1G Details

  • Manufacturer Part Number:

    NUP1301ML3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.715 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP1301ML3T1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NUP1301ML3T1G is a 3-pin SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. The recommended land pattern is available in the onsemi packaging specifications document.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 1uF with an ESR of 1ohm or less, and to place the capacitor as close to the output pin as possible. Additionally, the input capacitor should be at least 1uF with an ESR of 1ohm or less.
  • The maximum input voltage that NUP1301ML3T1G can handle is 18V. Exceeding this voltage may cause damage to the device.
  • The power dissipation of NUP1301ML3T1G can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • Yes, NUP1301ML3T1G is AEC-Q100 qualified, which makes it suitable for automotive applications. However, it is recommended to consult the onsemi automotive application note for specific requirements and guidelines.

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