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NUP1301U,115 - Nexperia

Description: NUP1301U - Ultra low capacitance ESD protection array

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Symbol
NUP1301U,115 - Nexperia - PCB symbol
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PCB Footprints
NUP1301U,115 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT323 (SC-70)
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3D Models
NUP1301U,115 - Nexperia - 3D model - SOT23 (3-Pin) - SOT323 (SC-70)
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NUP1301U,115 Details

  • Manufacturer Part Number:

    NUP1301U,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, SOT-323, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    MIL-STD-883

  • Breakdown Voltage-Min:

    100 V

  • Clamping Voltage-Max:

    20 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    200 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101; IEC-60134; IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    25 V

  • Reverse Current-Max:

    0.025 µA

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP1301U,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NUP1301U,115 is a standard SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure reliable operation of NUP1301U,115 in high-temperature environments, follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using thermal design and layout techniques to minimize thermal resistance and ensure adequate heat dissipation.
  • NUP1301U,115 has built-in ESD protection and latch-up prevention measures. However, it's still important to follow proper handling and assembly procedures to prevent damage. The datasheet provides guidelines for ESD protection and latch-up prevention.
  • Yes, NUP1301U,115 is AEC-Q100 qualified, making it suitable for use in automotive applications. However, it's essential to review the datasheet and application notes to ensure the device meets the specific requirements of your automotive application.
  • To troubleshoot issues with NUP1301U,115, start by reviewing the datasheet and application notes. Check for proper circuit design, component selection, and PCB layout. Use debugging tools and techniques, such as oscilloscopes and logic analyzers, to identify and isolate the issue.

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NUP1301U,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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