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NUP2301MW6T1G - onsemi

Description: Low Capacitance (2.0 pF Max Between I/O Lines; Single Package Integration Design; Provides ESD Protection for JEDEC Standards JESD22; Protection for IEC61000-4-2 (Level 4); Ensures Data Line Speed and Integrity; Directs the Transient to Either Positive Side or to Ground; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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Symbol
NUP2301MW6T1G - onsemi - PCB symbol
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PCB Footprints
NUP2301MW6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - NUP2301MW6T1G
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3D Models
NUP2301MW6T1G - onsemi - 3D model - SOT23 (6-Pin) - NUP2301MW6T1G
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NUP2301MW6T1G Details

  • Manufacturer Part Number:

    NUP2301MW6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.11

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    COMPLEX, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP2301MW6T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Monitor the device's thermal resistance and adjust the PCB design accordingly.
  • The NUP2301MW6T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NUP2301MW6T1G is AEC-Q101 qualified, making it suitable for automotive applications. However, additional testing and validation may be required for specific high-reliability applications. Consult with onsemi's application engineers for guidance.
  • Check the input voltage, output voltage, and load current to ensure they are within the recommended operating conditions. Verify that the device is properly connected and that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guidelines.

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NUP2301MW6T1G Overview

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Part Image NUP2301MW6T1 onsemi

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