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NUP3115UPMUTAG - onsemi

Description: Low Capacitance Data Lines (0.8pF Typical between I/O and GND); Protects up to Three Data Lines Plus a Vcc Pin; UDFN Package, 1.6 x 1.6mm; Low Profile of 0.50mm for Ultra Slim Design; ESD Rating: IEC6100042: Level, Contact (8kV); Vcc Pin = 15 V Protection; D1, D2, and D3 Pins = 6.4 V Minimum Protection; This is a Pb-Free Device

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PCB Footprints
NUP3115UPMUTAG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - UDFN6, 1.6x1.6, 0.5P CASE 517AP−01 ISSUE O
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3D Models
NUP3115UPMUTAG - onsemi  - 3D model - Small Outline No-lead - UDFN6, 1.6x1.6, 0.5P CASE 517AP−01 ISSUE O
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NUP3115UPMUTAG Details

  • Manufacturer Part Number:

    NUP3115UPMUTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN6 1.6x1.6, 0.5P

  • Package Description:

    UDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    517AP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.06

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    8 V

  • Breakdown Voltage-Min:

    6.4 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    22 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    S-XDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP3115UPMUTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The NUP3115UPMUTAG has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current transients.
  • Yes, the NUP3115UPMUTAG is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and qualified for the specific application.
  • Follow the recommended soldering temperature profile, and use a solder with a melting point above 217°C. Ensure that the device is properly aligned and secured during assembly, and avoid excessive mechanical stress.

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