Description:Low Clamping Voltage; Small Body Outline Dimensions on SC88 Package:0.082 x 0.078 (2.10 mm x 1.25 mm); Low Body Height: 0.043 (1.10 mm); Standoff Voltage: 5.5 V; Low Leakage; Response Time is Typically < 1.0 ns; IEC6100042 Level 4 ESD Protection; These Devices are PbFree and are RoHS Compliant; AECQ101 Qualified and PPAP Capable for SZNUP4114; Meets UL 94 V-0; SZ prefix for automotive and other applications requiring unique site and control change requirements
A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern is suggested. Refer to onsemi's application note AND8327/D for more details.
Ensure the device is operated within the recommended junction temperature (TJ) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe TJ. Monitor the device's thermal performance and adjust the system design accordingly.
Follow the ESD handling precautions outlined in onsemi's application note AND8003/D. Use ESD-protective packaging, wrist straps, and mats during handling and assembly. Implement ESD protection circuits, such as TVS diodes, in the system design.
Use onsemi's troubleshooting guide AND8341/D as a reference. Perform visual inspections, check for proper power sequencing, and verify signal integrity. Utilize oscilloscopes and logic analyzers to debug signal issues. Consult onsemi's support resources and application notes for specific guidance.
Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or die. Follow the Moisture Sensitivity Level (MSL) rating of 3, and bake the devices according to onsemi's recommendations if they are exposed to moisture.
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NUP4114UPXV6T1G Overview
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