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NUP412VP5T5G - onsemi

Description: Obsolete - ESD / Surge Protector

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PCB Footprints
NUP412VP5T5G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-953 CASE 527AB-01 ISSUE B_1
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NUP412VP5T5G - onsemi  - 3D model - SO Transistor Flat Lead - SOT-953 CASE 527AB-01 ISSUE B_1
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NUP412VP5T5G Details

  • Manufacturer Part Number:

    NUP412VP5T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-953 1x0.8, 0.35P

  • Package Description:

    LEAD FREE, CASE 527AB-01, SOT-953, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    527AE

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    12.7 V

  • Breakdown Voltage-Min:

    11.4 V

  • Breakdown Voltage-Nom:

    12 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    65 W

  • Number of Elements:

    4

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    9 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    9 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP412VP5T5G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to keep the junction temperature below the maximum rating.
  • The NUP412VP5T5G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NUP412VP5T5G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and qualified for the specific application.
  • Use a systematic approach to troubleshoot issues, starting with a review of the device's operating conditions, PCB layout, and component selection. Consult the datasheet and application notes, and consider using debugging tools, such as oscilloscopes or logic analyzers, to identify the root cause of the issue.

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NUP412VP5T5G Overview

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