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NUP4201MR6T1G - onsemi

Description: Obsolete - Ultra-Low Capacitance ESD Protection Array

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PCB Footprints
NUP4201MR6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02
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3D Models
NUP4201MR6T1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02
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NUP4201MR6T1G Details

  • Manufacturer Part Number:

    NUP4201MR6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    6 V

  • Clamping Voltage-Max:

    20 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    500 W

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

NUP4201MR6T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance.
  • The NUP4201MR6T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures to prevent damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads.
  • Yes, the NUP4201MR6T1G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within the recommended operating conditions and follow the manufacturer's guidelines for reliability and qualification.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check for voltage drops, noise, or signal integrity issues. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.

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NUP4201MR6T1G Overview

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