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NV24C04MUW3VTBG - onsemi

Description: Automotive Temperature Grade 1 (-40°C to +125°C); These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; 2.5 V to 5.5 V Supply Voltage Range; Supports Standard and Fast I2C Protocol; 16-Byte Page Write Buffer; Hardware Write Protection for Entire Memory; CAV Prefix for Automotive and Other Applications Requiring Site and Change Control; Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA); Low power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Ret

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PCB Footprints
NV24C04MUW3VTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - UDFN8 2x3, 0.5P CASE 517DH ISSUE A
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NV24C04MUW3VTBG - onsemi  - 3D model - Small Outline No-lead - UDFN8 2x3, 0.5P CASE 517DH ISSUE A
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NV24C04MUW3VTBG Details

  • Manufacturer Part Number:

    NV24C04MUW3VTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-8

  • Manufacturer Package Code:

    517DH

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2017-11-15

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDMR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    1

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX1

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.55 mm

  • Serial Bus Type:

    I2C

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    4 ms

  • Write Protection:

    HARDWARE

NV24C04MUW3VTBG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using thermal interface materials and ensure that the device is properly soldered to the PCB.
  • The recommended soldering conditions for the NV24C04MUW3VTBG are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering temperature profile that follows the JEDEC J-STD-020 standard.
  • To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the devices by the body or leads, avoid touching the pins, and use ESD-protected packaging and storage materials. It's also recommended to follow the ESD handling procedures outlined in the ANSI/ESD S20.20 standard.
  • Using a different voltage regulator or power supply may affect the device's performance, stability, and reliability. Ensure that the voltage regulator or power supply meets the recommended operating conditions, and consider the output voltage tolerance, noise, and ripple when selecting an alternative.

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NV24C04MUW3VTBG Overview

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