Part Image

NV24M01MUW3VTBG - onsemi

Description: Automotive Temperature Grade 1 (-40°C to +125°C); 1.8 V to 5.5 V Supply Voltage Range; 8-pin SOIC and TSSOP Packages; Supports Standard, Fast and FastPlus I2C Protocol; 256-Byte Page Write Buffer; Hardware Write Protection for Entire Memory; Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA); Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; This Device is PbFree, Halogen Free/BFR Free and is RoHS Compliant

Download NV24M01MUW3VTBG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NV24M01MUW3VTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - UDFN8 2x3, 0.5P CASE 517DH ISSUE A
click to zoom
3D Models
NV24M01MUW3VTBG - onsemi  - 3D model - Small Outline No-lead - UDFN8 2x3, 0.5P CASE 517DH ISSUE A
click to zoom

NV24M01MUW3VTBG Details

  • Manufacturer Part Number:

    NV24M01MUW3VTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-8

  • Package Description:

    UDFN-8

  • Manufacturer Package Code:

    517DH

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    IT ALSO OPERATES AT 1.8 TO 5.5V SUPPLY VOLTAGE AT 0.4 MHZ FREQUENCY

  • Clock Frequency-Max (fCLK):

    1 MHz

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.55 mm

  • Serial Bus Type:

    I2C

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    5 ms

NV24M01MUW3VTBG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias under the package is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased leakage current, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect against electrostatic discharge. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-safe handling and storage procedures.
  • Use a soldering temperature of 260°C (max) with a dwell time of 10-30 seconds. Ensure that the soldering process is controlled to prevent overheating, which can damage the device.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NV24M01MUW3VTBG Overview

Use the download button to access the NV24M01MUW3VTBG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NV24M, or try a keyword search, such as EEPROMs

Parts related to NV24M01MUW3VTBG

Showing 0 results