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NV25M01DTUTG - onsemi

Description: Automotive Temperature Grade 2 (-40°C to +105°C); 1.8 V to 5.5 V Supply Voltage Range; 8 lead SOIC and TSSOP Packages; 15 MHz SPI Compatible; SPI Modes (0,0) & (1,1); 256-byte Page Write Buffer; Additional Identification Page with Permanent Write Protection; Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; This Device is PbFree, Halogen Free/BFR Free and

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NV25M01DTUTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8, 4.4x3 CASE 948AL ISSUE A
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NV25M01DTUTG - onsemi  - 3D model - Small Outline Packages - TSSOP8, 4.4x3 CASE 948AL ISSUE A
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NV25M01DTUTG Details

  • Manufacturer Part Number:

    NV25M01DTUTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-8

  • Package Description:

    TSSOP-8

  • Manufacturer Package Code:

    948AL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    ALSO AVAILABLE 1.8-5.5V OPERATES WITH 5MHZ

  • Clock Frequency-Max (fCLK):

    5 MHz

  • Data Retention Time-Min:

    200

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000003 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    5 ms

NV25M01DTUTG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material (TIM) to fill any gaps between the device and the heat sink.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, it's recommended to follow standard ESD precautions, such as using an ESD wrist strap, ESD mat, or ESD bag. Additionally, ensure that the device is handled in a static-safe environment, and avoid touching the device pins or leads.
  • The recommended soldering conditions for the NV25M01DTUTG involve using a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. It's also recommended to use a solder with a melting point of 217°C to 221°C.

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NV25M01DTUTG Overview

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