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NVATS5A108PLZT4G - onsemi

Description: Last Shipments - P-Channel Power MOSFET, -60V, -27A, 43mΩ

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NVATS5A108PLZT4G - onsemi PCB footprint - Other - Other - NVATS5A108PLZT4G-2
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NVATS5A108PLZT4G - onsemi  - 3D model - Other - NVATS5A108PLZT4G-2
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NVATS5A108PLZT4G Details

  • Manufacturer Part Number:

    NVATS5A108PLZT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK (Single Gauge) / ATPAK

  • Manufacturer Package Code:

    369AM

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2016-07-04

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    95 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    77 A

  • Drain-source On Resistance-Max:

    0.0104 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    72 W

  • Pulsed Drain Current-Max (IDM):

    231 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVATS5A108PLZT4G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The NVATS5A108PLZT4G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NVATS5A108PLZT4G is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade reliability. However, it's essential to follow the recommended design and testing guidelines to ensure the device meets the specific application requirements.
  • Follow the recommended PCB assembly and soldering guidelines to ensure reliable operation. Use a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max). Avoid using excessive soldering temperature or time, as this can damage the device.

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NVATS5A108PLZT4G Overview

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