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NVBG020N090SC1 - onsemi

Description: Qualified for Automotive According to AEC−Q101; 900V rated; Max RDS(on) = 28 mΩ at Vgs = 15V, Id = 60A; High Speed Switching and Low Capacitance; 100% UIL Tested; Devices are RoHS Compliant

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NVBG020N090SC1 - onsemi PCB footprint - Other - Other - NVBG020N090SC1-2
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NVBG020N090SC1 - onsemi  - 3D model - Other - NVBG020N090SC1-2
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NVBG020N090SC1 Details

  • Manufacturer Part Number:

    NVBG020N090SC1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK7 (TO-263-7L HV)

  • Package Description:

    D2PAK-7

  • Manufacturer Package Code:

    418BJ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2019-10-31

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • Avalanche Energy Rating (Eas):

    264 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    900 V

  • Drain Current-Max (ID):

    112 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JEDEC-95 Code:

    TO-263CB

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    477 W

  • Pulsed Drain Current-Max (IDM):

    448 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

NVBG020N090SC1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board. A minimum of 2oz copper thickness is recommended.
  • To ensure the device is properly biased, make sure to follow the recommended biasing circuit in the datasheet, and use a stable voltage source with minimal noise and ripple. Also, ensure that the input and output capacitors are properly selected and placed close to the device.
  • The maximum allowed junction temperature for the NVBG020N090SC1 is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Yes, the NVBG020N090SC1 is a high-reliability device that is suitable for use in high-reliability applications such as automotive, industrial, and aerospace. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device operates within its specified parameters.
  • To handle ESD protection for the NVBG020N090SC1, follow the recommended ESD handling procedures during manufacturing and assembly, and use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins.

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NVBG020N090SC1 Overview

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