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NVBLS0D5N04CTXG - onsemi

Description: Pb-Free and RoHS Compliant; UIS Capability; Low QG and Capacitance; Low RDS(on); AEC−Q101 Qualified and PPAP Capable

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PCB Footprints
NVBLS0D5N04CTXG - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE A_2022
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NVBLS0D5N04CTXG - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE A_2022
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NVBLS0D5N04CTXG Details

  • Manufacturer Part Number:

    NVBLS0D5N04CTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Package Description:

    H-PSOF8L, 8 PIN

  • Manufacturer Package Code:

    100CU

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2020-06-23

  • Manufacturer:

    onsemi

  • YTEOL:

    5.22

  • Avalanche Energy Rating (Eas):

    1512 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    300 A

  • Drain-source On Resistance-Max:

    0.57 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    227 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    198.4 W

  • Pulsed Drain Current-Max (IDM):

    4700 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVBLS0D5N04CTXG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, follow the recommended PCB layout and thermal design guidelines.
  • The NVBLS0D5N04CTXG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NVBLS0D5N04CTXG is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • The recommended soldering conditions for the NVBLS0D5N04CTXG are: peak temperature = 260°C, time above 217°C = 30 seconds, and time above 183°C = 90 seconds. Follow the recommended soldering profile to prevent damage to the device.

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NVBLS0D5N04CTXG Overview

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