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NVD5117PLT4G-VF01 - onsemi

Description: Low RDS(on); High Current Capability; Avalanche Energy Specified; AEC-Q101 Qualified; RoHS Compliant

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NVD5117PLT4G-VF01 - onsemi - PCB symbol
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PCB Footprints
NVD5117PLT4G-VF01 - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE F_1
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NVD5117PLT4G-VF01 - onsemi - 3D model - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE F_1
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NVD5117PLT4G-VF01 Details

  • Manufacturer Part Number:

    NVD5117PLT4G-VF01

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DPAK-3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    240 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    419 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVD5117PLT4G-VF01 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the VIN pin is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and minimize power dissipation.
  • Yes, the NVD5117PLT4G-VF01 is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and design guidelines.
  • Check the input voltage, output current, and thermal design. Verify that the device is operated within the recommended conditions. Use a thermal camera or thermometer to monitor the device temperature. Consult the datasheet and application notes for troubleshooting guidelines.

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NVD5117PLT4G-VF01 Overview

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