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NVH4L027N65S3F - onsemi

Description: Best in Class body diode; Internal Rg; Lower RDS(ON) / Same Packages; Lower FOM (RDS (ON) max X QG typ & RDS (ON) max X EOSS); Internal Zener / 650 V BVdss

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NVH4L027N65S3F Details

  • Manufacturer Part Number:

    NVH4L027N65S3F

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-4

  • Manufacturer Package Code:

    340CJ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    1610 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.0274 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    26 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    595 W

  • Pulsed Drain Current-Max (IDM):

    187.5 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVH4L027N65S3F Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NVH4L027N65S3F is -55°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Additionally, ensure that the device is operated within the recommended operating conditions, including voltage, current, and temperature ranges.
  • For optimal thermal management, it's recommended to use a PCB layout that provides good thermal conductivity and heat dissipation. This can include using thermal vias, thermal pads, and heat sinks. Additionally, ensure that the device is mounted on a PCB with a sufficient copper area to dissipate heat effectively.
  • To handle ESD protection, follow proper handling and storage procedures for the device, including using ESD-safe packaging and handling tools. Additionally, ensure that the device is properly grounded during assembly and testing, and consider using ESD protection devices such as TVS diodes or ESD protection ICs.
  • Follow the recommended soldering and assembly procedures specified in the datasheet, including using a soldering iron with a temperature range of 250°C to 260°C, and ensuring that the device is properly aligned and seated during assembly.

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NVH4L027N65S3F Overview

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