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NVHL015N065SC1 - onsemi

Description: Devices are RoHS Compliant; Qualified for Automotive According to AEC−Q101; 650V rated; Max RDS(on) = 18 mΩ at Vgs = 18V, Id = 75A; 100% UIL Tested

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NVHL015N065SC1 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3LD
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NVHL015N065SC1 - onsemi  - 3D model - Transistor Outline, Vertical - TO-247-3LD
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NVHL015N065SC1 Details

  • Manufacturer Part Number:

    NVHL015N065SC1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3LD

  • Manufacturer Package Code:

    340CX

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2020-03-23

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    166 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40.04 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    774 W

  • Pulsed Drain Current-Max (IDM):

    847 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON CARBIDE

NVHL015N065SC1 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a thermal relief pattern on the top layer, and a solid copper pour on the bottom layer connected to the drain pin. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider derating the device's power handling capabilities at higher temperatures.
  • The maximum allowed voltage slew rate for the NVHL015N065SC1 is not explicitly stated in the datasheet. However, as a general guideline, a slew rate of 10-20 V/ns is considered safe for most power MOSFETs. Faster slew rates may lead to increased electromagnetic interference (EMI) and reduced device reliability.
  • While the NVHL015N065SC1 is a high-speed power MOSFET, its suitability for high-frequency switching applications depends on the specific requirements. The device's switching characteristics, such as rise and fall times, should be evaluated against the application's needs. Additionally, consider the device's parasitic capacitances, gate drive requirements, and potential for oscillations or ringing.
  • When selecting a gate driver for the NVHL015N065SC1, consider the device's gate charge requirements, the desired switching frequency, and the available power supply voltage. A gate driver with a high current capability, fast rise and fall times, and a suitable output voltage range is recommended. Additionally, ensure the gate driver is compatible with the device's input capacitance and can provide a stable, low-impedance output.

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NVHL015N065SC1 Overview

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