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NVMFD5C470NLWFT1G - onsemi

Description: Small Footprint (5x6 mm); Low rDS(on); Low QG and Capacitance; NVMFD5C470NLWF − Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVMFD5C470NLWFT1G - onsemi PCB footprint - Other - Other - DFN8 5x6 (SO8FL) CASE 506BT
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NVMFD5C470NLWFT1G - onsemi  - 3D model - Other - DFN8 5x6 (SO8FL) CASE 506BT
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NVMFD5C470NLWFT1G Details

  • Manufacturer Part Number:

    NVMFD5C470NLWFT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL Dual / DFN-8

  • Manufacturer Package Code:

    506BT

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    49 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain-source On Resistance-Max:

    0.0178 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    110 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMFD5C470NLWFT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad of the NVMFD5C470NLWFT1G to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using a thermal management strategy, such as a heat sink or thermal interface material, to keep the device within its specified temperature range.
  • Exceeding the maximum junction temperature can lead to reduced reliability, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within its specified temperature range to maintain its performance and longevity.
  • To handle ESD protection, it's recommended to follow proper handling and storage procedures, such as using anti-static bags or containers, and grounding oneself before handling the device. Additionally, consider implementing ESD protection circuits or devices in the system design to prevent damage from electrostatic discharge.
  • When assembling or reworking the PCB, it's essential to follow proper soldering techniques, use a soldering iron with a temperature-controlled tip, and avoid applying excessive heat or force, which can damage the device. Additionally, ensure that the PCB is cleaned and dried properly to prevent moisture-related issues.

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NVMFD5C470NLWFT1G Overview

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