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NVMFS024N06CT1G - onsemi

Description: Low RDS(on); Low QG and Capacitance; Small Footprint (5x6mm); AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NVMFS024N06CT1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL)_.2021
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3D Models
NVMFS024N06CT1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL)_.2021
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NVMFS024N06CT1G Details

  • Manufacturer Part Number:

    NVMFS024N06CT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    14 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    25 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5.05 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    28 W

  • Pulsed Drain Current-Max (IDM):

    158 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMFS024N06CT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a minimum of 2oz copper thickness, and ensuring a solid ground plane on the top and bottom layers. Additionally, it's recommended to use vias to connect the thermal pad to the ground plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The recommended soldering conditions for NVMFS024N06CT1G involve using a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a soldering iron temperature of 350°C (662°F). It's also recommended to use a solder with a melting point of 217°C (423°F) or higher.
  • To handle ESD protection during handling and assembly, it's recommended to use an ESD wrist strap or mat, handle the devices by the body or pins, and avoid touching the pins or die. Additionally, use ESD-protected packaging and follow proper handling procedures to prevent damage.
  • The recommended storage conditions for NVMFS024N06CT1G involve storing the devices in their original packaging, in a dry, cool place with a temperature range of -40°C to 125°C (-40°F to 257°F) and humidity below 60%. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.

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NVMFS024N06CT1G Overview

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