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NVMFS040N10MCLT1G - onsemi

Description: Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVMFS040N10MCLT1G Details

  • Manufacturer Part Number:

    NVMFS040N10MCLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    DFN5, SO-8FL, 6 PIN

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    109 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.038 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3.7 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    36 W

  • Pulsed Drain Current-Max (IDM):

    94 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVMFS040N10MCLT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance is to have a solid copper plane on the top and bottom layers of the PCB, with vias connecting them to dissipate heat. Additionally, it's recommended to have a thermal pad on the bottom of the package connected to a solid copper plane.
  • The power-up sequence for NVMFS040N10MCLT1G is critical. It's recommended to power up the VCC pin first, followed by the VPP pin. The VCC pin should be powered up to its nominal voltage before applying any signals to the VPP pin.
  • The maximum operating temperature range for NVMFS040N10MCLT1G is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The NVMFS040N10MCLT1G can be programmed using a variety of methods, including in-system programming (ISP), in-application programming (IAP), and programming through a serial interface such as SPI or I2C. The specific programming method will depend on the application and the development environment.
  • The data retention period for NVMFS040N10MCLT1G is a minimum of 20 years at a temperature of 25°C. However, the actual data retention period may be longer depending on the operating conditions and the quality of the device.

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NVMFS040N10MCLT1G Overview

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