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NVMFS6H800NT1G - onsemi

Description: Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; NVMFS6H800NWF − Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVMFS6H800NT1G - onsemi PCB footprint - Other - Other - NVMFS6H864NT1G-2
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NVMFS6H800NT1G - onsemi  - 3D model - Other - NVMFS6H864NT1G-2
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NVMFS6H800NT1G Details

  • Manufacturer Part Number:

    NVMFS6H800NT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5x6, 1.27P (SO−8FL)

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    506EZ

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    1271 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    203 A

  • Drain-source On Resistance-Max:

    0.0021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    27 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    200 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMFS6H800NT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for NVMFS6H800NT1G is -40°C to 125°C.
  • To ensure data integrity during power cycling, it is recommended to use a voltage supervisor or a power-on reset circuit to ensure that the device is fully powered up before accessing the memory.
  • The recommended PCB layout for NVMFS6H800NT1G involves placing the device near the center of the board, using a solid ground plane, and minimizing signal trace lengths to reduce noise and interference.
  • Yes, NVMFS6H800NT1G is suitable for high-reliability applications due to its high-quality manufacturing process, rigorous testing, and compliance with industry standards such as AEC-Q100.
  • In case of errors during programming or erase operations, it is recommended to retry the operation up to a maximum of three times. If the error persists, the device should be reset and the operation retried.

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NVMFS6H800NT1G Overview

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