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NVMFS6H824NLWFT1G - onsemi

Description: Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; NVMFS6H824NLWF − Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVMFS6H824NLWFT1G Details

  • Manufacturer Part Number:

    NVMFS6H824NLWFT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW5 4.90x5.90x1.00, 1.27P

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    507BA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2020-01-06

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    1081 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    110 A

  • Drain-source On Resistance-Max:

    0.0052 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    116 W

  • Pulsed Drain Current-Max (IDM):

    722 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMFS6H824NLWFT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for the NVMFS6H824NLWFT1G can be found in the onsemi application note AND9004/D, which provides guidelines for PCB design, thermal management, and layout considerations to ensure optimal performance and reliability.
  • The NVMFS6H824NLWFT1G has built-in fault detection and protection mechanisms, such as over-temperature protection, over-voltage protection, and under-voltage lockout. However, additional external circuitry may be required to implement more comprehensive fault detection and protection mechanisms. Consult the onsemi application note AND9005/D for more information.
  • The recommended operating conditions for the NVMFS6H824NLWFT1G are specified in the datasheet. To ensure reliable operation, it is essential to operate the device within the recommended operating conditions, including voltage, current, and temperature ranges. Additionally, follow proper PCB design and layout guidelines, and ensure adequate thermal management and decoupling.
  • The NVMFS6H824NLWFT1G can be programmed and configured using the onsemi programming tool, which is available on the onsemi website. Consult the onsemi application note AND9006/D for more information on programming and configuration guidelines.
  • The NVMFS6H824NLWFT1G meets industry standards for reliability and quality, including AEC-Q100 and ISO/TS 16949. onsemi provides detailed reliability and quality metrics, including MTBF, FIT, and failure rates, which can be found in the device's datasheet and reliability report.

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NVMFS6H824NLWFT1G Overview

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