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NVMJST0D9N04CTXG - onsemi

Description: Gull-wings leads for an improved BLR performance; AEC−Q101 Qualified and PPAP Capable; Top Side Cooling; Small Footprint (5x7 mm); Low RDS(on); Low QG and Capacitance; RoHS Compliant

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PCB Footprints
NVMJST0D9N04CTXG - onsemi PCB footprint - Other - Other - TCPAK10 5.1x7.5, 1.0P CASE 760AG ISSUE D_2024
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3D Models
NVMJST0D9N04CTXG - onsemi  - 3D model - Other - TCPAK10 5.1x7.5, 1.0P CASE 760AG ISSUE D_2024
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NVMJST0D9N04CTXG Details

  • Manufacturer Part Number:

    NVMJST0D9N04CTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TCPAK10 5.1x7.5, 1.0P

  • Manufacturer Package Code:

    760AG

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand, Vietnam

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    578 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    531 A

  • Drain-source On Resistance-Max:

    0.00107 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    10

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    555 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMJST0D9N04CTXG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's performance. Additionally, ensure that the device is properly soldered and the PCB is designed to minimize thermal stress.
  • Using a different voltage regulator than the one recommended in the datasheet may affect the device's performance, reliability, and power consumption. It's crucial to ensure that the chosen regulator meets the device's voltage and current requirements, and that it doesn't introduce noise or oscillations that could impact the device's operation.
  • To troubleshoot issues related to the device's POR circuitry, check the power supply voltage, ensure that the voltage ramp-up time is within the recommended specifications, and verify that the POR pin is properly connected and not loaded. Also, review the device's reset timing and ensure that it's within the recommended specifications.
  • When using the NVMJST0D9N04CTXG in a high-reliability or safety-critical application, it's essential to follow the recommended design and manufacturing guidelines, ensure that the device is properly qualified and certified, and consider implementing redundant or fail-safe mechanisms to mitigate potential failures.

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NVMJST0D9N04CTXG Overview

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