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NVMYS021N06CLTWG - onsemi

Description: Small Footprint (5x6mm); Low RDS (ON); Low QG and Capacitance; LFPAK4 Package; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free and are RoHS Compliant

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NVMYS021N06CLTWG - onsemi PCB footprint - Other - Other - NVMYS021N06CLTWG-1
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NVMYS021N06CLTWG Details

  • Manufacturer Part Number:

    NVMYS021N06CLTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFPAK-4

  • Manufacturer Package Code:

    760AB

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand, Vietnam

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    43 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    9.8 A

  • Drain-source On Resistance-Max:

    0.0315 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    28 W

  • Pulsed Drain Current-Max (IDM):

    131 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMYS021N06CLTWG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for NVMYS021N06CLTWG is -40°C to 150°C.
  • To ensure optimal performance, the device should be biased with a gate-source voltage (Vgs) between 4.5V and 10V, and a drain-source voltage (Vds) not exceeding 60V.
  • For optimal thermal performance, it is recommended to use a PCB with a thermal pad and a heat sink. The device should be placed on a copper plane with a minimum size of 1 inch x 1 inch, and the thermal pad should be connected to a heat sink with a thermal interface material.
  • To protect the device from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded.
  • The recommended gate resistor value for NVMYS021N06CLTWG is between 10 ohms and 100 ohms, depending on the specific application and switching frequency.

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NVMYS021N06CLTWG Overview

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