Description:Small Footprint; Low RDS (ON); Low QG and Capacitance; LFPAK4 Package, Industry Standard; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free and are RoHS Compliant
Mainland China, Malaysia, Philippines, Thailand, Vietnam
ECCN Code:
EAR99
Manufacturer:
onsemi
YTEOL:
3
Avalanche Energy Rating (Eas):
1621 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
40 V
Drain Current-Max (ID):
252 A
Drain-source On Resistance-Max:
0.00115 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-PSSO-G4
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
4
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
134 W
Pulsed Drain Current-Max (IDM):
900 A
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON
NVMYS1D3N04CTWG Frequently Asked Questions (FAQs)
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
Ensure that the device is operated within the recommended voltage and current ratings. Also, consider the thermal derating of the device, and ensure that the junction temperature (Tj) does not exceed 150°C. Proper PCB design, thermal management, and cooling mechanisms can help achieve this.
The NVMYS1D3N04CTWG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV HBM (Human Body Model) and 100V MM (Machine Model) ESD protection is recommended.
Yes, the NVMYS1D3N04CTWG is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard, which ensures the device can operate reliably in harsh environments.
The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30s, and time above 183°C 60s. It's also recommended to use a soldering iron with a temperature control system to prevent overheating.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NVMYS1D3N04CTWG Overview
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