NVMYS5D3N04CTWG footprint, schematic symbol and 3D model by onsemi

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NVMYS5D3N04CTWG - onsemi PCB footprint - Other - Other - LFPAK4 5x6CASE 760AB ISSUE C

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Part Number NVMYS5D3N04CTWG
Manufacturer onsemi
Pin Count 8
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - LFPAK4 5x6CASE 760AB ISSUE C
Released Date Feb 12, 2020
Last Modified Date Jan 22, 2025 4:53 PM UTC
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NVMYS5D3N04CTWG Details

Manufacturer Part Number:
NVMYS5D3N04CTWG
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
LFPAK-4
Manufacturer Package Code:
760AB
Country Of Origin:
Philippines
ECCN Code:
EAR99
Factory Lead Time:
14 Weeks
Manufacturer:
onsemi
YTEOL:
6
Avalanche Energy Rating (Eas):
1667 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
40 V
Drain Current-Max (ID):
71 A
Drain-source On Resistance-Max:
0.0053 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-PSSO-G4
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
4
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
50 W
Pulsed Drain Current-Max (IDM):
352 A
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON

NVMYS5D3N04CTWG Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power dissipation. Additionally, ensure that the device is properly soldered and the PCB is designed to minimize thermal resistance.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
To handle ESD protection for the NVMYS5D3N04CTWG, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. Additionally, ensure that the device is properly grounded during assembly and testing.
The recommended soldering conditions for the NVMYS5D3N04CTWG involve using a soldering temperature between 240°C to 260°C, with a maximum soldering time of 10 seconds. It's also essential to use a soldering iron with a suitable tip size and to avoid applying excessive force or pressure during the soldering process.

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NVMYS5D3N04CTWG Overview

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