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NVTFS040N10MCLTAG - onsemi

Description: Small Footprint (3x3 mm); Low RDS(on); Low QG and Capacitance; Wettable Flank Option available; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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PCB Footprints
NVTFS040N10MCLTAG - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUED
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3D Models
NVTFS040N10MCLTAG - onsemi  - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUED
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NVTFS040N10MCLTAG Details

  • Manufacturer Part Number:

    NVTFS040N10MCLTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8 / u8FL

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511AB

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    109 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    6.1 A

  • Drain-source On Resistance-Max:

    0.038 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3.2 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    36 W

  • Pulsed Drain Current-Max (IDM):

    82 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVTFS040N10MCLTAG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, use a suitable thermal management system, and ensure that the device is properly soldered to the PCB. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The NVTFS040N10MCLTAG has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2kV and a machine model (MM) of 200V are recommended.
  • Yes, the NVTFS040N10MCLTAG is suitable for high-reliability and automotive applications. It is AEC-Q101 qualified and meets the requirements for automotive-grade devices. However, it is essential to follow the recommended operating conditions and ensure that the device is properly validated for the specific application.
  • The device should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to store the device in its original packaging or in a sealed bag with desiccant. Avoid bending or flexing the leads, and handle the device by the body, not the leads.

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NVTFS040N10MCLTAG Overview

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