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NVTFS5C471NLWFTAG - onsemi

Description: Small Footprint (3x3 mm); Low On-Resistance; Low Capacitance; NVTFS5C471NLWF − Wettable Flanks Product; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVTFS5C471NLWFTAG - onsemi - PCB symbol
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PCB Footprints
NVTFS5C471NLWFTAG - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D_2022-2
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3D Models
NVTFS5C471NLWFTAG - onsemi - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D_2022-2
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NVTFS5C471NLWFTAG Details

  • Manufacturer Part Number:

    NVTFS5C471NLWFTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFNW8 3.3x3.3, 0.65P (Full−Cut ?8FL WF)

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    515AN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    66 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain-source On Resistance-Max:

    0.0155 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    163 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVTFS5C471NLWFTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced lifespan, decreased performance, and potential device failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

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NVTFS5C471NLWFTAG Overview

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