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NVTFS6H880NTAG - onsemi

Description: Small Footprint (3.3 x 3.3 mm); Low RDS (ON); Low QG and Capacitance; Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVTFS6H880NTAG - onsemi PCB footprint - Other - Other - NVTFS6H880NTAG-2
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NVTFS6H880NTAG - onsemi  - 3D model - Other - NVTFS6H880NTAG-2
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NVTFS6H880NTAG Details

  • Manufacturer Part Number:

    NVTFS6H880NTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8 / u8FL

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511AB

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Date Of Intro:

    2018-06-29

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    76 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    6.3 A

  • Drain-source On Resistance-Max:

    0.032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3.6 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    31 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVTFS6H880NTAG Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. Ensure a minimum of 10mm x 10mm of copper area for heat dissipation.
  • Implement a thermal management system, such as a heat sink or thermal interface material, to keep the junction temperature below 150°C. Also, ensure proper airflow and avoid thermal hotspots.
  • The NVTFS6H880NTAG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure all equipment is grounded.
  • Yes, the NVTFS6H880NTAG is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions and design guidelines to meet the required reliability standards.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check for voltage drops, current spikes, or thermal issues. Consult the datasheet and application notes for troubleshooting guidelines.

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NVTFS6H880NTAG Overview

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