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NVTR4502PT1G - onsemi

Description: SOT-23 Surface Mount for Small Footprint (3x3mm); RoHS Compliant; Leading Planar technology for Low Gate Charge/Fast Switching; Low RDS(on) for Low Conduction Losses; AEC-Q101 Qualified and PPAP capable

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PCB Footprints
NVTR4502PT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BAS21LT1G-1
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NVTR4502PT1G - onsemi  - 3D model - SOT23 (3-Pin) - BAS21LT1G-1
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NVTR4502PT1G Details

  • Manufacturer Part Number:

    NVTR4502PT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    CASE 318-08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.13 A

  • Drain-source On Resistance-Max:

    0.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.25 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVTR4502PT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The device can withstand voltage transients up to 40V for a duration of 100ms, but it's recommended to limit transients to 30V or less to ensure reliable operation.
  • Yes, the device is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Check for proper PCB layout, thermal management, and input voltage regulation. Verify that the device is operated within its recommended specifications and that the input voltage is within the recommended range.

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Manufacturer Collaborated
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NVTR4502PT1G Overview

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