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NX3008CBKS,115 - NXP

Description: Dual N/P-Channel MOSFET, 200 mA, 350 mA, 30 V, 6-Pin SOT-363 NXP NX3008CBKS,115

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PCB Footprints
NX3008CBKS,115 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
NX3008CBKS,115 - NXP  - 3D model - SOT23 (6-Pin) - SOT363
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NX3008CBKS,115 Details

  • Manufacturer Part Number:

    NX3008CBKS,115

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, SOT-363, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    2.2 pF

  • JESD-30 Code:

    R-PDSO-G6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.445 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NX3008CBKS,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the IC. Refer to the NXP application note AN11555 for more details.
  • Use a heat sink with a thermal resistance of ≤ 10°C/W, and ensure good airflow around the device. Also, consider using a thermal interface material (TIM) to improve heat transfer between the IC and heat sink.
  • The maximum allowed voltage on the VCC pin is 3.6V. Exceeding this voltage can cause permanent damage to the device.
  • Check the power supply voltage, ensure the EN pin is high, and verify that the input voltage is within the specified range. Also, check for any short circuits or incorrect pin connections.
  • Yes, the NX3008CBKS,115 is suitable for battery-powered devices due to its low quiescent current (IQ) of 2.5 μA. However, consider using a low-dropout regulator (LDO) to minimize power consumption.

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NX3008CBKS,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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