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NX3008PBK,215 - Nexperia

Description: NX3008PBK,215 Dual P-Channel MOSFET, 200 mA, 30 V, 6-Pin SOT-363 Nexperia

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NX3008PBK,215 - Nexperia - PCB symbol
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NX3008PBK,215 - Nexperia PCB footprint - Other - Other - NX3008PBK,215-1
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NX3008PBK,215 - Nexperia - 3D model - Other - NX3008PBK,215-1
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NX3008PBK,215 Details

  • Manufacturer Part Number:

    NX3008PBK,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.23 A

  • Drain-source On Resistance-Max:

    4.1 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    2.3 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.14 W

  • Pulsed Drain Current-Max (IDM):

    1 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NX3008PBK,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermal interface material (TIM) with a high thermal conductivity, and follow the recommended operating conditions and derating guidelines in the datasheet.
  • The NX3008PBK,215 has built-in ESD protection, but handling precautions are still necessary. Use an anti-static wrist strap, handle the device by the body or pins, and avoid touching the pins or die. Store the device in an anti-static bag or container.
  • Yes, the NX3008PBK,215 is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions, and consult with Nexperia's application notes and technical support for specific requirements.
  • To troubleshoot and debug issues, use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check the power supply, decoupling, and PCB layout for any issues. Consult the datasheet, application notes, and Nexperia's technical support for guidance.

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NX3008PBK,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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