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NX30P6093AUK - NXP

Description: WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included),2.8V to 20.0V , 5.6A , -40°C to +85°C

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Symbol
NX30P6093AUK - NXP - PCB symbol
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PCB Footprints
NX30P6093AUK - NXP PCB footprint - BGA - BGA - SOT1397-6 (WLCSP20)
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3D Models
NX30P6093AUK - NXP - 3D model - BGA - SOT1397-6 (WLCSP20)
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NX30P6093AUK Details

  • Manufacturer Part Number:

    NX30P6093AUK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5.13

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NX30P6093AUK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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