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NX3DV3899HRZ - NXP

Description: SSL MATRIX CONTROLLER, REEL 7" Q1 NDP SSB, TAPE + REEL ROHS COMPLIANT: YES

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PCB Footprints
NX3DV3899HRZ - NXP PCB footprint - Other - Other - NX3DV3899HRZ-2
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NX3DV3899HRZ - NXP  - 3D model - Other - NX3DV3899HRZ-2
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NX3DV3899HRZ Details

  • Manufacturer Part Number:

    NX3DV3899HRZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HXQFN-16

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    70 dB

  • On-state Resistance Match-Nom:

    0.8 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HXQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Signal Current-Max:

    0.35 A

  • Supply Current-Max (Isup):

    0.005 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    90 ns

  • Switch-on Time-Max:

    120 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NX3DV3899HRZ Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the application note AN11524, which includes guidelines for thermal pad connection, PCB layer stack-up, and heat sink design.
  • The NX3DV3899HRZ has multiple power modes, including low-power modes. To configure the device for optimal power consumption, refer to the device's datasheet and application notes, which provide guidance on register settings, clock management, and power gating techniques.
  • NXP recommends following standard ESD protection and handling procedures, such as using anti-static wrist straps, mats, and bags, and avoiding direct contact with the device's pins. Additionally, the device has built-in ESD protection, but it's still important to follow proper handling procedures to prevent damage.
  • NXP provides a range of debugging tools and resources, including the NXP LPCXpresso IDE, which includes a debugger and trace capabilities. Additionally, the device's datasheet and application notes provide guidance on troubleshooting common issues and using debug interfaces like JTAG and SWD.
  • The NX3DV3899HRZ is a highly integrated device, and compatibility and interoperability considerations will depend on the specific use case and components used. NXP provides guidance on compatibility and interoperability in the device's datasheet and application notes, and it's recommended to consult with NXP support or a qualified engineer for specific guidance.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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