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NX3DV42GU,115 - NXP

Description: USB Switch ICs NX3DV42GU/XQFN10///REEL 7 Q1/T1 *STANDARD MARK SM

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PCB Footprints
NX3DV42GU,115 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT1160-1
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3D Models
NX3DV42GU,115 - NXP  - 3D model - Quad Flat No-Lead - SOT1160-1
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NX3DV42GU,115 Details

  • Manufacturer Part Number:

    NX3DV42GU,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    XQFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    SOT1160-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    R-PQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    1.8 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    30 dB

  • On-state Resistance Match-Nom:

    0.65 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.07,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    50 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    30 ns

  • Switch-on Time-Max:

    40 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.4 mm

NX3DV42GU,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • The power-up sequence should follow the recommended timing diagram in the datasheet. Ensure a minimum of 10 ms delay between VCC and VIO power-up, and a maximum of 100 ms delay between VIO and VCC power-down.
  • Use the device's power-down modes, such as the 'Sleep' mode, and optimize the clock frequency and voltage settings. Implement a dynamic voltage and frequency scaling (DVFS) scheme to minimize power consumption.
  • Implement ESD protection diodes on all input/output pins, and ensure a minimum of 1 kΩ series resistance on all input signals. Use a TVS (Transient Voltage Suppressor) diode on the power supply lines.

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NX3DV42GU,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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