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NX3L1G3157GMZ - NXP

Description: Analog Switch ICs Low-ohmic single-pole double-throw analog switch 1.4V ~ 4.3V , 250mW , 60 MHz , -40°C ~ 125°C (TA)

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NX3L1G3157GMZ - NXP PCB footprint - Other - Other - SOT886_2026
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NX3L1G3157GMZ - NXP  - 3D model - Other - SOT886_2026
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NX3L1G3157GMZ Details

  • Manufacturer Part Number:

    NX3L1G3157GMZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XSON-6

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-N6

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    4.1 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, EXTREMELY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Signal Current-Max:

    0.35 A

  • Supply Current-Max (Isup):

    0.007 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    30 ns

  • Switch-on Time-Max:

    52 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NX3L1G3157GMZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the NX3L1G3157GMZ should include a solid ground plane, short traces, and minimal vias to reduce signal loss and noise. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation across the entire temperature range, ensure that the device is operated within the recommended voltage and current specifications. Additionally, consider using thermal management techniques such as heat sinks or thermal interfaces to maintain a stable temperature.
  • Operating the NX3L1G3157GMZ at a lower voltage supply than the recommended range may result in reduced performance, increased power consumption, and potential reliability issues. It is not recommended to operate the device outside of the specified voltage range.
  • To handle ESD protection for the NX3L1G3157GMZ, follow proper ESD handling procedures during assembly and installation. Use ESD-protective packaging, wrist straps, and mats to prevent static discharge. Additionally, consider using ESD protection devices such as TVS diodes or ESD arrays in the circuit design.
  • When using the NX3L1G3157GMZ in a high-reliability or safety-critical application, consider implementing redundant systems, error detection and correction mechanisms, and fault-tolerant design principles. Additionally, ensure that the device is operated within the recommended specifications and that the system is designed to mitigate potential failure modes.

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NX3L1G3157GMZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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