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NX3L1T3157GM - NXP

Description: 1 Circuit IC Switch 2:1 500mOhm 6-XSON, SOT886 (1.45x1) , 1.4V ~ 4.3V , 60MHz , -40°C ~ 125°C (TA)

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Symbol
NX3L1T3157GM - NXP - PCB symbol
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PCB Footprints
NX3L1T3157GM - NXP PCB footprint - Other - Other - SOT886_2025-2
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3D Models
NX3L1T3157GM - NXP - 3D model - Other - SOT886_2025-2
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NX3L1T3157GM Details

  • Manufacturer Part Number:

    NX3L1T3157GM

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Package Description:

    XSON-6

  • Pin Count:

    6

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8.28

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    1.7 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    90 ns

  • Switch-on Time-Max:

    120 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NX3L1T3157GM Frequently Asked Questions (FAQs)

  • A good PCB layout for the NX3L1T3157GM involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. This includes using a heat sink, keeping the device away from heat sources, and using thermal vias to dissipate heat. Additionally, ensure that the device is operated within its specified temperature range (-40°C to 125°C).
  • While the NX3L1T3157GM has built-in ESD protection, it's not foolproof. The device can withstand ESD pulses up to 2 kV according to the IEC 61000-4-2 standard. However, it's still important to follow proper ESD handling and storage procedures to prevent damage.
  • Yes, the NX3L1T3157GM is suitable for high-frequency applications up to 100 MHz. However, it's essential to follow proper layout and termination guidelines to minimize signal reflections and ensure signal integrity.
  • To troubleshoot issues with the output voltage, check the input voltage, output load, and PCB layout. Ensure that the input voltage is within the specified range, the output load is within the recommended range, and the PCB layout is correct. Also, verify that the device is not overheating.

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NX3L1T3157GM Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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