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NX7002BKMBYL - Nexperia

Description: DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm,60 V 350mA (Ta) 350mW (Ta), 3.1W (Tc)

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PCB Footprints
NX7002BKMBYL - Nexperia PCB footprint - Other - Other - DFN1006B-3 (SOT883B)_2023
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3D Models
NX7002BKMBYL - Nexperia  - 3D model - Other - DFN1006B-3 (SOT883B)_2023
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NX7002BKMBYL Details

  • Manufacturer Part Number:

    NX7002BKMBYL

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN1006B-3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT883B

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    3.2 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    3 pF

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.1 W

  • Pulsed Drain Current-Max (IDM):

    0.9 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NX7002BKMBYL Frequently Asked Questions (FAQs)

  • Nexperia recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • Use a pull-up resistor (e.g., 2.2 kΩ) on the SCL and SDA lines, and ensure the bus capacitance is within the recommended range (400 pF). Also, use a common ground plane and minimize bus length to reduce noise and signal degradation.
  • The maximum allowed voltage on the input pins is 5.5 V, which is the absolute maximum rating. However, for normal operation, the recommended input voltage range is 1.8 V to 5.0 V.
  • The NX7002BKMBYL has an internal POR and BOD circuitry. The POR ensures the device resets properly during power-up, while the BOD detects voltage drops and resets the device if the voltage falls below the threshold (typically 1.8 V). No external components are required for these features.
  • The WAKEUP pin is an active-low input that can be used to wake up the device from a low-power state. Connect the WAKEUP pin to a GPIO or an external interrupt source to trigger the device to exit low-power mode.

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NX7002BKMBYL Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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