NXH3670UK/A1Z - NXP

NXH3670UK/A1Z Details

• Manufacturer Part Number:

  NXH3670UK/A1Z

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  WLCSP-34

• Country Of Origin:

  Taiwan

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  27 Weeks

• Manufacturer:

  NXP Semiconductors

• JESD-30 Code:

  R-XBGA-B34

• Length:

  2.87 mm

• Moisture Sensitivity Level:

  1

• Number of Terminals:

  34

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -20 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  XFBGA

• Package Equivalence Code:

  BGA34,5X7,16

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  0.41 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  2.45 mm

• uPs/uCs/Peripheral ICs Type:

  RFSOC