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NZ8F3V3MX2WT5G - onsemi

Description: These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; Zener Breakdown Voltage Range 2.4 V to 47 V; Wettable Flank Package for optimal Automated Optical Inspection (AOI); ±5% and ±2% Tolerances Available

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NZ8F3V3MX2WT5G - onsemi PCB footprint - Other - Other - NZ8F3V3MX2WT5G-2
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NZ8F3V3MX2WT5G Details

  • Manufacturer Part Number:

    NZ8F3V3MX2WT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFNW2

  • Manufacturer Package Code:

    711BG

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2020-04-06

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    7.58%

  • Working Test Current:

    5 mA

NZ8F3V3MX2WT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board. Additionally, keeping the PCB layers as thin as possible and using a high-thermal-conductivity material can help.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a heat sink or thermal interface material. Additionally, derating the device's power dissipation and using a thermally conductive PCB material can help.
  • The NZ8F3V3MX2WT5G has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging. Avoid touching the device's pins or handling it in a way that could generate static electricity.
  • The NZ8F3V3MX2WT5G is an AEC-Q100 qualified device, making it suitable for automotive applications. However, for high-reliability applications, it's essential to follow the recommended operating conditions, perform thorough testing, and consider using additional protection circuits or redundancy to ensure the required level of reliability.
  • To troubleshoot issues with the device, start by reviewing the application circuit and PCB layout to ensure they meet the recommended design guidelines. Check for proper power supply decoupling, thermal management, and ESD protection. Use oscilloscopes or logic analyzers to monitor the device's input and output signals, and consult the datasheet and application notes for guidance on troubleshooting specific issues.

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NZ8F3V3MX2WT5G Overview

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