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NZ9F3V9ST5G - onsemi

Description: Standard Zener Breakdown Voltage Range 2.4 V to 18 V; Steady State Power Rating of 250 mW; Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm); Low Body Height: 0.016 (0.40 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; Tight Tolerance VZ; These are PbFree Devices; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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NZ9F3V9ST5G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD??23%0
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NZ9F3V9ST5G - onsemi  - 3D model - Small Outline Diode - SOD??23%0
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NZ9F3V9ST5G Details

  • Manufacturer Part Number:

    NZ9F3V9ST5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923, 1.0x0.6, 0.40 Max Height

  • Package Description:

    SOD-923, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    3.9 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    -2.5 mV/°C

  • Voltage Tol-Max:

    3.35%

  • Working Test Current:

    5 mA

NZ9F3V9ST5G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • Use a human body model (HBM) ESD protection circuit with a minimum of 2kV rating. Also, ensure that the PCB layout and assembly process minimize the risk of ESD damage.
  • Yes, but ensure that you follow the recommended qualification and testing procedures for high-reliability or automotive applications, as specified in the AEC-Q101 or equivalent standards.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly decoupled and that the PCB layout meets the recommended guidelines. Consult the datasheet and application notes for troubleshooting guides.

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NZ9F3V9ST5G Overview

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