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NZ9F5V6T5G - onsemi

Description: Standard Zener Breakdown Voltage Range 2.4 V to 24 V; Steady State Power Rating of 250 mW; Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm); Low Body Height: 0.016 (0.40 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; These are PbFree Devices

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NZ9F5V6T5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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NZ9F5V6T5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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NZ9F5V6T5G Details

  • Manufacturer Part Number:

    NZ9F5V6T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923, 1.0x0.6, 0.40 Max Height

  • Pin Count:

    2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    60 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    5.6 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    2.5 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

NZ9F5V6T5G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet, but it's recommended to limit the voltage and current to 80% of the maximum ratings to ensure reliable operation.
  • Yes, but ensure the switching frequency is within the recommended range (typically <100 kHz). Also, consider the device's capacitance and inductance when designing the switching circuit.
  • Use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent ESD damage.

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