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OC2321VQFN8XTMA1 - Infineon

Description: OPTIGA™ Connect IoT OC2321

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Symbol
OC2321VQFN8XTMA1 - Infineon - PCB symbol
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PCB Footprints
OC2321VQFN8XTMA1 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - PG-VQFN-8-4
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3D Models
OC2321VQFN8XTMA1 - Infineon - 3D model - Small Outline No-lead - PG-VQFN-8-4
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OC2321VQFN8XTMA1 Details

  • Manufacturer Part Number:

    OC2321VQFN8XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFN-8

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

OC2321VQFN8XTMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top layer.
  • Infineon recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK between the device and the heat sink. Additionally, ensure good airflow and avoid blocking the airflow around the device.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above liquidus of 30-60 seconds, and a cooling rate of 4°C/s. Refer to the Infineon soldering guide for more details.
  • Infineon recommends storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive force to the leads or package.
  • Infineon recommends handling the devices by the body, avoiding touching the leads or electrical contacts. Clean the devices with a soft brush and a mild detergent, and avoid using ultrasonic cleaning or harsh chemicals.

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OC2321VQFN8XTMA1 Overview

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