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OMAP3503DZCBCS - Texas Instruments

Description: Applications Processor

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PCB Footprints
OMAP3503DZCBCS - Texas Instruments PCB footprint - BGA - BGA - CBC s-PBGA-515 Package
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3D Models
OMAP3503DZCBCS - Texas Instruments  - 3D model - BGA - CBC s-PBGA-515 Package
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OMAP3503DZCBCS Details

  • Manufacturer Part Number:

    OMAP3503DZCBCS

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    GREEN, PLASTIC, FCBGA-515

  • Pin Count:

    515

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B515

  • Number of Terminals:

    515

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA515,26X26,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

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OMAP3503DZCBCS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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