OMAPL138BGWTMEP - Texas Instruments

OMAPL138BGWTMEP Details

• Manufacturer Part Number:

  OMAPL138BGWTMEP

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Pin Count:

  361

• Country Of Origin:

  Philippines

• ECCN Code:

  3A001.A.2.C

• HTS Code:

  8542.31.00.75

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• JESD-30 Code:

  S-PBGA-B361

• JESD-609 Code:

  e0

• Length:

  16 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  361

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA361,19X19,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  220

• Seated Height-Max:

  1.4 mm

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  MILITARY

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  20

• Width:

  16 mm

• uPs/uCs/Peripheral ICs Type:

  SoC