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ONET1191PRGTR - Texas Instruments

Description: 11.3Gb/s Limiting Amplifier

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PCB Footprints
ONET1191PRGTR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGT0016C height=1
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3D Models
ONET1191PRGTR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGT0016C height=1
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ONET1191PRGTR Details

  • Manufacturer Part Number:

    ONET1191PRGTR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Applications:

    SDH; SONET

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    49 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ATM/SONET/SDH SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ONET1191PRGTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.
  • The power-up sequence should follow the recommended timing diagram in the datasheet. Ensure a minimum 10 ms delay between VCC and VDD power-up, and a 100 ms delay between VDD and EN pin assertion.
  • Use the device's power-down mode, disable unnecessary features, and optimize the clock frequency. Consider using a low-dropout regulator (LDO) to reduce power consumption.
  • Implement ESD protection diodes on all input and output pins. Use a TVS (transient voltage suppressor) diode on the power supply lines and ensure a minimum 1 kΩ series resistor on all input pins.

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ONET1191PRGTR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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