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ONET1191PRGTT - Texas Instruments

Description: 11.3Gb/s Limiting Amplifier

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PCB Footprints
ONET1191PRGTT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGT0016
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3D Models
ONET1191PRGTT - Texas Instruments  - 3D model - Quad Flat No-Lead - RGT0016
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ONET1191PRGTT Details

  • Manufacturer Part Number:

    ONET1191PRGTT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Applications:

    SDH; SONET

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    49 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ATM/SONET/SDH SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ONET1191PRGTT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.
  • Keep sensitive analog traces away from digital traces, use a solid ground plane, and add EMI filters or shielding if necessary. Follow Texas Instruments' recommended layout guidelines.
  • Use the device's power-down modes, optimize the clock frequency, and minimize the number of active circuits. Consider using a power management IC to regulate voltage and current.
  • Use Texas Instruments' recommended debugging tools, such as the XDS110 emulator, and follow a structured debugging approach. Verify the device's configuration and programming before debugging.

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ONET1191PRGTT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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